| 摘要 |
<p>PURPOSE: An assembly of a multi-pattern wiring substrate and an assembling method of a multi-pattern wiring substrate are provided to be able to implement separate wiring substrates with excellent accuracy by effectively preventing the bending of a frame substrate. CONSTITUTION: An assembly (10) of a multi-pattern wiring substrate integrally forms a margin region (Y) in a frame shape which is discarded on each circumference of a base substrate (1) and a frame substrate (2). A first dummy assembling pad (6) is formed on the top surface of the thrown-away margin of the base substrate. A second dummy assembling pad is located in the location partially elapsed with the first dummy assembling pad in the bottom surface of the thrown-away margin region of the frame substrate, wherein the center is located in the center of the thrown-away margin region other than the center of the first dummy assembling pad. The first and second assembling pads are welded through soldering.</p> |
