发明名称 Footprint for Prototyping High Frequency Printed Circuit Boards
摘要 A PCB footprint consisting of a plurality of pads, positioned such that many different electronic components can be mounted which would otherwise require a custom circuit board. One or more of the leads can be connected via a low-impedance path to a ground plane, making a suitable platform for prototyping high-frequency designs.
申请公布号 US2015223323(A1) 申请公布日期 2015.08.06
申请号 US201414173106 申请日期 2014.02.05
申请人 O'Flynn Colin Patrick 发明人 O'Flynn Colin Patrick
分类号 H05K1/02;H05K1/11 主分类号 H05K1/02
代理机构 代理人
主权项 1. A footprint for generic circuit board layouts comprising: a main mounting pad; a plurality of extensions from this main pad which are electrically unconnected from this main pad, where the spacing and size of such extensions is designed to allow multiple dissimilar sized component packages to be mounted; the design of the extensions is such that two or more of the extensions can be coupled to transmission lines using a bridging material; the design of the pattern is such that it assumes a ground plane is present on a separate layer from the layer the pattern will be etched onto
地址 Halifax CA