发明名称 ELECTROLESS DEPOSITION OF Bi, Sb, Si, Sn, AND Co AND THEIR ALLOYS
摘要 The present invention relates to production of composite materials utilizing an electroless deposition method for coating substrates with bismuth, antimony, tin, silicon, cobalt and their various compositional alloys. Substrates may be materials comprised of copper, brass, carbon, and silicon. These substrates are immersed in aqueous or ethylene glycol based solutions containing soluble ions of the desired coating material. The present invention generates desired coatings at room temperature during a period of immersion of one hour or less. In one exemplary embodiment, the method provides the electroless deposition of silicon onto copper nanoparticles in a room temperature solution of ethylene glycol. The coated nanoparticles may then be processed to form a battery electrode. In another exemplary embodiment, the method provides electroless deposition of tin onto brass foil in a room temperature aqueous solution. Battery electrodes may then be punched from the coated sheet.
申请公布号 US2015221930(A1) 申请公布日期 2015.08.06
申请号 US201414170841 申请日期 2014.02.03
申请人 Manivannan Ayyakkannu;Beck Faith 发明人 Manivannan Ayyakkannu;Beck Faith
分类号 H01M4/1395;C23C18/31;C23C18/16;H01M4/1393;H01M4/04 主分类号 H01M4/1395
代理机构 代理人
主权项 1. A method of preparing composite materials comprising: preparing a first electroless deposition solution where the first electroless deposition solution comprises a first solvent, one or more first soluble sources of deposition cations, a reducing agent, and a complexing agent where, the one or more first soluble sources of deposition cations is selected from the group of soluble salts of bismuth, antimony, silicon, tin, and cobalt, the one or more first soluble sources of deposition cations are present in an amount in excess of 0.01M and less than 0.4M, the reducing agent is present in an amount below 0.02M, the complexing agent is present in an amount below 0.85M, the first electroless deposition solution has a temperature from about 25° C. and about 95° C.; and immersing for a first time period of immersion in the range of about 30 seconds to about 60 minutes in the first electroless deposition solution, a substrate where the substrate comprises copper, brass, silicon, carbon, or combinations thereof.
地址 Morgantown WV US