| 发明名称 |
ENCAPSULANT COMPOSITION |
| 摘要 |
Compositions that have relatively high Tg, relatively low CTE, and relatively low modulus are suitable for use as encapsulants with stress-sensitive electronic assemblies, such as those containing low k dielectrics. These compositions are used in methods of die attachment, encapsulation, and solder bump reinforcement. |
| 申请公布号 |
US2015221527(A1) |
申请公布日期 |
2015.08.06 |
| 申请号 |
US201514604764 |
申请日期 |
2015.01.26 |
| 申请人 |
Rohm and Haas Electronic Materials LLC |
发明人 |
MORGANELLI Paul L.;CHO Jae-Kyu;CORDERO Jenna M. |
| 分类号 |
H01L21/56;H01L23/31;H01L23/22;C08L63/00;C08K3/36 |
主分类号 |
H01L21/56 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A composition suitable for use as a capillary underfill comprising: a liquid cyclic siloxane comprising a plurality of glycidyl ether moieties; an aromatic thermosetting resin; and a curing agent. |
| 地址 |
Marlborough MA US |
