发明名称 SURFACE PROTECTIVE SHEET SUBSTRATE AND SURFACE PROTECTIVE SHEET
摘要 Provided is a surface protective sheet substrate capable of forming a surface protective sheet endowed with both curling inhibition and adhesion mark inhibition. The surface protective sheet substrate provided by this invention comprises a polyolefin resin which accounts for more than 50% by weight of the entire substrate. The substrate comprises a layer X constituting a first surface of the substrate and a layer Y constituting the second surface of the substrate. The layer X is constituted with a resin composition having a tensile elastic modulus (EX) of 400 MPa or greater, but 750 MPa or less. The layer Y is constituted with a resin composition having a tensile elastic modulus (EY) of 400 MPa or greater, but 750 MPa or less. The layer X has a thickness tX and the layer Y has a thickness tY, satisfying 0.5≦tX·EX·tY·EY≦1.5.
申请公布号 US2015218424(A1) 申请公布日期 2015.08.06
申请号 US201514611502 申请日期 2015.02.02
申请人 NITTO DENKO CORPORATION 发明人 IGARASHI Takeshi;YAMAMOTO Yasunori;WAKAYAMA Nao
分类号 C09J7/02;B32B27/08;B32B27/32 主分类号 C09J7/02
代理机构 代理人
主权项 1. A surface protective sheet substrate, wherein the substrate comprises a polyolefin resin which accounts for more than 50% by weight of the entire substrate, the substrate comprises a layer X that is a resin layer constituting a first surface of the substrate and a layer Y that is a resin layer constituting the second surface of the substrate, the layer X is constituted with a resin composition having a tensile elastic modulus (EX (MPa)) of 400 MPa or greater, but 750 MPa or less, the layer Y is constituted with a resin composition having a tensile elastic modulus (EY (MPa)) of 400 MPa or greater, but 750 MPa or less, and when the layer X has a thickness tX (μm) and the layer Y has a thickness tY (μm), the substrate satisfies the next inequality: 0.5≦tX·EX/tY·EY≦1.5
地址 Osaka JP