发明名称 CONNECTION BODY
摘要 Electroconductive particles sandwiched between the main surfaces of substrate electrodes and electrode terminals are adequately pressed in and remain conductive even when the electroconductive particles are caught between the stepped sections of the substrate electrodes and the electrode terminals. An electronic component (18) is connected to a circuit substrate (12) by an anisotropic electroconductive adhesive (1), stepped sections (27, 28) which meet at the respective side edge sections are formed on the substrate electrodes (17a) of the circuit substrates (12) and the electrode terminals (19) of the electronic components (18), electroconductive particles (4) are sandwiched between the main surfaces and between the stepped sections (27, 28) of the substrate electrodes (17a) and the electrode terminals (19), and the electroconductive particles (4) and the stepped sections (27, 28) satisfy the formula a + b + c ≤ 0.8D (1). In the formula, a is the height of the stepped sections of the electrode terminals, b is the height of the stepped sections of the substrate electrodes, c is the gap between the stepped sections, and D is the diameter of the electroconductive particles.
申请公布号 WO2015115657(A1) 申请公布日期 2015.08.06
申请号 WO2015JP52920 申请日期 2015.02.03
申请人 DEXERIALS CORPORATION 发明人 SARUYAMA, KENICHI;AKUTSU, YASUSHI
分类号 H01L21/60 主分类号 H01L21/60
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