| 摘要 |
<p>The problem addressed by the present invention is to provide a technology that can improve the reliability of a power module configured using a switching element of a cascode connection type. To solve the problem, in a power module configured using a switching element resulting from cascode connecting a normally on element and a normally off element, a drain substrate on which a normally off chip is mounted, a drain substrate on which a normally on chip is mounted, a source substrate, and a gate substrate are disposed in the given order in a first direction, and a gate resistor is disposed between the source substrate and the gate substrate. As a result, the length of a plurality of wires, which connect a plurality of source electrodes formed at the top surface of the normally on chip and the drain substrate on which the normally off chip is mounted, is shortened.</p> |
