| 发明名称 |
PCB EMBEDDED POWER MODULE |
| 摘要 |
A printed circuit board assembly comprises a printed circuit board having at least one conductive layer supported by a substrate layer, and at least one power semiconductor device, wherein the at least one power semiconductor device is at least partly embedded in the substrate layer. |
| 申请公布号 |
US2015223320(A1) |
申请公布日期 |
2015.08.06 |
| 申请号 |
US201514597695 |
申请日期 |
2015.01.15 |
| 申请人 |
HS Elektronik Systeme GmbH |
发明人 |
Gerhäußer Thomas E. |
| 分类号 |
H05K1/02;H05K1/03;H05K3/30;H05K1/18 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board assembly, comprising
a printed circuit board having at least one conductive layer supported by a substrate layer, and at least one power semiconductor device, wherein the at least one power semiconductor device is at least partly embedded in the substrate layer. |
| 地址 |
Nördlingen DE |
