发明名称 ENCAPSULATION STRUCTURE OF OLED DEVICE
摘要 An encapsulation structure of OLED device, comprising an upper substrate and a lower substrate that are disposed in opposition to each other. An OLED device is provided on the lower substrate, and an encapsulating thin film is provided on the OLED device. An edge of the lower substrate and an edge of the upper substrate are hermetically coupled through an obstruction wall, and there is a recess at the edge of the lower substrate on the side facing the upper substrate. One end of the obstruction wall that is coupled to the lower substrate is positioned within the recess of the lower substrate, and configured to seal the periphery of the encapsulating thin film within the recess of the lower substrate. With the encapsulation structure, the effect of water vapor and oxygen on the OLED device can be reduced, and service life of the OLED device is prolonged.
申请公布号 US2015221888(A1) 申请公布日期 2015.08.06
申请号 US201314358794 申请日期 2013.12.02
申请人 BOE TECHNOLOGY GROUP CO., LTD. 发明人 Zhang Yuxin
分类号 H01L51/52;H01L51/00 主分类号 H01L51/52
代理机构 代理人
主权项 1. An encapsulation structure of OLED device, comprising: an upper substrate and a lower substrate that are disposed in opposition to each other, wherein an OLED device is provided on a side of the lower substrate facing the upper substrate, an encapsulating thin film is provided on the OLED device; an obstruction wall is provided between an edge of the lower substrate and an edge of the upper substrate, the edge of the lower substrate and the edge of the upper substrate are hermetically coupled through the obstruction wall, there is a recess at the edge of the lower substrate on the side facing the upper substrate, one end of the obstruction wall that is coupled to the lower substrate is positioned within the recess of the lower substrate, and configured to seal a periphery of the encapsulating thin film within the recess of the lower substrate.
地址 Beijing CN