APPARATUS AND METHODS FOR THERMAL MANAGEMENT OF A COMPUTING DEVICE

摘要

In accordance with aspects of the disclosure, a system and methods for thermal management of at least one processor positioned within a computing device include drawing external fluid into an enclosure of the computing device via an inlet aperture with use of at least one active pump positioned within the enclosure, directing the drawn fluid from the inlet aperture through an inlet channel formed within the enclosure to the active pump, passing the drawn fluid over the processor positioned within the enclosure by directing the drawn fluid from the active pump through an outlet channel formed within the enclosure, and expelling the drawn fluid from the enclosure of the computing device via an outlet aperture with use of the active pump after passing the drawn fluid over the processor so as to provide thermal management of the processor.

主权项

1. A method for thermal management of at least one processor positioned within a computing device, comprising:
drawing external fluid into an enclosure of the computing device through an inlet aperture with use of at least one active pump positioned within the enclosure; directing the drawn fluid from the inlet aperture through an inlet channel formed within a first area of the enclosure to the at least one active pump; passing the drawn fluid over the at least one processor positioned within a second area of the enclosure by directing the drawn fluid from the at least one active pump through an outlet channel formed within the second area of the enclosure, wherein the active pump includes one or more moveable membrane structures, the movement of which generates a pressurized fluid flow along a path from the inlet channel to the outlet channel; and expelling the drawn fluid from the enclosure of the computing device via an outlet aperture with use of the at least one active pump after passing the drawn fluid over the at least one processor so as to provide thermal management of the at least one processor, wherein the inlet and outlet apertures are formed within a hinge assembly of the enclosure of the computing device.