| 发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOE DEVICE |
| 摘要 |
A method of manufacturing a semiconductor device capable of thinning a semiconductor chip can be performed while preventing the semiconductor chip from being damaged. A method of manufacturing a semiconductor device includes: preparing a semiconductor substrate including a plurality of semiconductor chips, attaching the semiconductor substrate to a support substrate with an adhesive support film, removing an edge region of the semiconductor substrate together with a portion of the adhesive support film between the edge region of the semiconductor substrate and the support substrate and, thereafter, polishing the semiconductor substrate to thin the semiconductor substrate. |
| 申请公布号 |
US2015221517(A1) |
申请公布日期 |
2015.08.06 |
| 申请号 |
US201514613822 |
申请日期 |
2015.02.04 |
| 申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
Kim Eun-mi;Kang Un-byoung;Cho Tae-je;Ahn Jung-seok |
| 分类号 |
H01L21/306;H01L21/768;H01L21/304;H01L21/78 |
主分类号 |
H01L21/306 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a semiconductor device, the method comprising:
preparing a semiconductor substrate including a plurality of semiconductor chips; attaching the semiconductor substrate to a support substrate with an adhesive support film; removing an edge region of the semiconductor substrate together with a portion of the adhesive support film between the edge region of the semiconductor substrate and the support substrate; and after removing the edge region of the semiconductor substrate, polishing the semiconductor substrate to thin the semiconductor substrate. |
| 地址 |
Suwon-si KR |
