| 摘要 |
Disclosed is a dry film photoresist. A dry film photoresist according to an embodiment of the present invention comprises: a base film; a photosensitive resin layer connected to the base film; a first cover film formed in a first thickness, covering the photosensitive resin layer and elongated to a first direction; and a second cover film formed in a second thickness, laminated on a first cover film, and elongated to a second direction. |
