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发明名称
表面処理銅箔及びそれを用いた積層板、プリント配線板、電子機器、並びに、プリント配線板の製造方法
摘要
申请公布号
JP5758035(B2)
申请公布日期
2015.08.05
申请号
JP20140166241
申请日期
2014.08.18
申请人
发明人
分类号
C25D7/06;B32B15/01;B32B15/08;C25D1/04;H05K1/09;H05K3/38;H05K3/46
主分类号
C25D7/06
代理机构
代理人
主权项
地址
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