发明名称 |
SILVER PLATING MATERIAL AND METHOD FOR MANUFACTURING SAME |
摘要 |
In a silver-plated product wherein a surface layer of silver is formed on the surface of a base material or on the surface of an underlying layer formed on the base material, the surface layer of silver is formed by electroplating in a silver plating bath which contains 1 to 15 mg/L of selenium and wherein a mass ratio of silver to free cyanogen is in the range of from 0.9 to 1.8, and thereafter, an aging treatment is carried out to produce a silver-plated product wherein an area fraction in {200} orientation of the surface layer is 15 % or more. |
申请公布号 |
EP2902533(A1) |
申请公布日期 |
2015.08.05 |
申请号 |
EP20130842760 |
申请日期 |
2013.09.17 |
申请人 |
DOWA METALTECH CO., LTD |
发明人 |
SHINOHARA, KEISUKE;OGATA, MASAFUMI;MIYAZAWA, HIROSHI;SUGAWARA, AKIRA |
分类号 |
C25D7/00;B32B15/01;C22C5/06;C22C9/00;C22F1/08;C22F1/14;C25D3/46;C25D5/50;H01H1/02;H01H1/023;H01H11/04;H01R13/03 |
主分类号 |
C25D7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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