发明名称 MEMS microphone
摘要 A micro-electro mechanical system (MEMS) microphone includes: a printed circuit substrate; a MEMS chip that is combined with the printed circuit substrate and has a MEMS inner space; and a case that is combined with the printed circuit substrate, accommodates the MEMS chip, and forms an inner space that is separated from an external space, wherein the case is a double-type case including an inner case and an outer case, a medium acoustic path space is formed between the inner case and the outer case, and the printed circuit substrate includes a substrate acoustic path that connects the medium acoustic path space to the MEMS inner space of the MEMS chip so that external sound passing through the sound hole enters the MEMS inner space of the MEMS chip after passing through the medium acoustic path space.
申请公布号 US9099569(B2) 申请公布日期 2015.08.04
申请号 US201414261633 申请日期 2014.04.25
申请人 BSE CO., LTD. 发明人 Lee Sang Ho;Shim Yong Hyun
分类号 H01L29/84;H04R19/04;B81B3/00;B81B7/00 主分类号 H01L29/84
代理机构 Ladas & Parry LLP 代理人 Ladas & Parry LLP
主权项 1. A micro-electro mechanical system (MEMS) microphone comprising: a printed circuit substrate; a MEMS chip that is combined with the printed circuit substrate and has a MEMS inner space; and a case that is combined with the printed circuit substrate, accommodates the MEMS chip, and forms an inner space that is separated from an external space, wherein the case comprises an inner case and an outer case, the inner space is formed by combining a lower edge of the inner case with the printed circuit substrate, the outer case is formed to surround the inner case at an outside of the inner space, a lower edge thereof is combined with the printed circuit substrate so that a medium acoustic path space is formed between the inner case and the outer case, and comprises a sound hole so that external sound enters the medium acoustic path space, and the printed circuit substrate comprises a substrate acoustic path that connects the medium acoustic path space to the MEMS inner space of the MEMS chip so that the external sound that passes through the sound hole enters the MEMS inner space of the MEMS chip after passing through the medium acoustic path space.
地址 Incheon KR
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