Thin film electrode ceramic substrate and method for manufacturing the same

摘要

Disclosed herein are a thin film electrode ceramic substrate and a method for manufacturing the same. The thin film electrode ceramic substrate includes: a ceramic substrate; one or more anti-etching metal layers formed in a surface of the ceramic substrate; thin film electrode pattern formed on the anti-etching metal layers; and a plating layer formed on the thin film electrode pattern, wherein respective edge portions of the thin film electrode pattern are contacted with the anti-etching metal layer, and thus, an undercut defect occurring between the surface of the ceramic substrate and the thin film electrode pattern and between the thin film electrode patterns due to an etchant can be prevented and the binding strength of the entire thin film electrode pattern can be enhanced, resulting in securing durability and reliability of the thin film electrode patterns.

主权项

1. A thin film electrode ceramic substrate, comprising:
a ceramic substrate; a plurality of anti-etching metal layers formed in a surface of the ceramic substrate; a thin film electrode pattern formed on the anti-etching metal layers; and a plating layer formed on the thin film electrode pattern, wherein the anti-etching metal layers are extant under respective edge portions of the thin film electrode pattern and extends, in the ceramic substrate, a distance away from the thin film electrode pattern, the edge portions of the thin film electrode pattern are contacted with the respective anti-etching metal layers, the anti-etching metal layers are spaced apart from each other by a predetermined distance, except in a region where the anti-etching metal layers are contacted with the respective edge portions of the thin film electrode pattern, and the ceramic substrate underlays entire bottom surfaces of the anti-etching metal layers.