发明名称 Packaging of power supply using modular electronic modules
摘要 An enclosure for a power supply is disclosed. The enclosure may include a control compartment configured to receive one or more control components, a transformer compartment positioned adjacent to the control compartment and configured to receive a transformer, and a power cell compartment positioned adjacent to the control compartment and the transformer compartment. The power cell compartment may be configured to receive a plurality of power cells arranged into a plurality of pods. The power cells may be received in the power cell compartment such that each power cell in a first pod is adjacent to at least two other power cells in the first pod. A voltage difference between adjacent power cells in a pod may be less than an acceptable voltage tolerance.
申请公布号 US9099914(B2) 申请公布日期 2015.08.04
申请号 US201213535655 申请日期 2012.06.28
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 Wissner Kevin D.;Novack Edward A.
分类号 H05K7/20;H02M7/00;H05K7/14 主分类号 H05K7/20
代理机构 代理人
主权项 1. An enclosure for a power supply comprising: a control compartment configured to receive one or more control components; a transformer compartment positioned adjacent to the control compartment and configured to receive a transformer; and a power cell compartment positioned adjacent to the control compartment and the transformer compartment, the power cell compartment configured to receive a plurality of power cells arranged into a plurality of pods, wherein first power cells of a first pod are arranged in series to produce a single output, wherein the plurality of power cells are received in the power cell compartment such that each first power cell in the first pod is adjacent to at least two other first power cells in the first pod, and wherein a voltage difference between adjacent power cells in a pod is less than an acceptable voltage tolerance.
地址 München DE