Workpiece dividing method including two laser beam application steps

摘要

A dividing method for a workpiece having a substrate with a film formed on the front side thereof. A first laser beam is applied to the film from the front side of the workpiece along the streets formed on the film, thereby forming a plurality of laser processed grooves along the streets to cut the film along the streets. Thereafter, an adhesive tape is attached to the front side of the workpiece. Thereafter, a second laser beam is applied to the substrate from the back side of the workpiece along the streets in the condition where the focal point of the second laser beam is set inside the substrate, thereby forming a plurality of modified layers inside the substrate along the streets. Thereafter, the adhesive tape is expanded to thereby divide the substrate along the streets, thereby obtaining a plurality of individual devices. Thereafter, the back side of the substrate of each device is ground to remove the modified layers and reduce the thickness of each device to a predetermined thickness.

主权项

1. A workpiece dividing method for dividing a workpiece along a plurality of crossing streets into each device, said workpiece having a substrate and a metal film formed on the front side of said substrate, said streets being formed on the front side of said metal film to partition said substrate into a plurality of regions where a plurality of devices are respectively formed, said workpiece dividing method comprising:
a metal film cutting step of applying a first laser beam having an absorption wavelength to said metal film from the front side of said workpiece along said streets to form a plurality of laser processed grooves along said streets, thereby completely cutting through said metal film along said streets to expose said substrate, wherein during said metal film cutting step, the focal point of the first laser beam is set at a position slightly above the metal film, and said substrate is at most only minimally ablated by said first laser beam; a tape mounting step of attaching the front side of said workpiece to an adhesive tape supported by an annular frame after performing said metal film cutting step; a modified layer forming step of applying a second laser beam having a transmission wavelength to said substrate from the back side of said workpiece along said streets in the condition where the focal point of said second laser beam is set inside said substrate after performing said tape mounting step, thereby forming a plurality of modified layers inside said substrate along said streets; a dividing step of expanding said adhesive tape to apply an external force to said substrate after performing said modified layer forming step, thereby dividing said substrate along said streets; and a back grinding step of grinding the back side of said substrate to remove said modified layers after performing said dividing step, wherein during said back grinding step, said modified layers are removed by reducing the thickness of the substrate to a predetermined thickness by using a rotatable grinding wheel, without reducing the length or width of individual devices of the divided substrate.