发明名称 Lead frame for light emitting device package, light emitting device package, and illumination apparatus employing the light emitting device package
摘要 Lead frames for light emitting device packages, light emitting device packages, and illumination apparatuses employing the light emitting device packages. The lead frame including a plurality of mounting portions on which a plurality of light emitting device chips are mounted; a plurality of connection portions for circuit connecting the plurality of light emitting device chips; a terminal portion extended from the plurality of connection portions. The light emitting device package is formed by directly mounting the plurality of light emitting device chips on the lead frame and packaging the mounted light emitting device chips on the lead frame. The lead frame includes a plurality of connection portions for circuit connecting the plurality of light emitting device chips and a terminal portion in which a part of a circuit thereof is exposed.
申请公布号 US9099332(B2) 申请公布日期 2015.08.04
申请号 US201314137885 申请日期 2013.12.20
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 Moon Kyung-mi;Song Young-hee;Choi Ill-heung;Lee Jeong-wook;Lee Young-jin
分类号 H05B37/00;H05B39/00;H05B41/00;H01L25/075;H01L33/54;H01L33/62 主分类号 H05B37/00
代理机构 McDermott Will & Emery LLP 代理人 McDermott Will & Emery LLP
主权项 1. A method of manufacturing a light emitting device package, the method comprising: preparing a lead frame that comprises a first frame, a second frame, and an intermediate connection portion, wherein the intermediate connection portion is connected directly to both the first frame and the second frame via cleavage portions; mounting a light emitting device chip on a mounting portion of the intermediate connection portion; and removing the cleavage portions, wherein the first frame comprises a first extension portion extending in a first direction and a first connection portion protruding from a front end portion of the first extension portion in a direction toward the second frame, the second frame comprises a second extension portion extending parallel to the first extension portion and a second connection portion protruding from a rear end portion of the second extension portion in a direction toward the first frame, the lead frame comprises a plurality of the intermediate connection portions, each of the intermediate connection portions being arranged between the first extension portion and the second extension portion, and the first connection portion, the plurality of intermediate connection portions, and the second connection portion are arranged in a line in the first direction.
地址 Suwon-Si, Gyeonggi-Do KR