| 摘要 |
PROBLEM TO BE SOLVED: To provide a component built-in wiring board having excellent reliability by preventing adhesion between a core substrate and a wiring lamination part from being deteriorated. ! SOLUTION: A component built-in wiring board includes a core substrate 11, components 100 and 101, a resin filler 93 and a wiring lamination part. The components 100 and 101 are housed in a plurality of housing hole parts 90 and 91, respectively, in the state that a core principal surface and a component principal surface are directed on the same side. The resin filler 93 is filled in a space between the inner wall surfaces 92 of the housing hole parts 90 and 91 and component side surfaces 104. The core substrate 11 has a bridge part 61 positioned between the adjacent housing hole parts 90 and 91 and an outer peripheral part 62 in which a rear surface side conductor layer 81 is formed. An insular layer 241 independent from the rear surface side conductor layer 81 and projected at the same height as the surface |
