| 摘要 |
The present invention relates to a squeegee to print a printed circuit board and, more specifically, relates to a squeegee to print a printed circuit board, which reduces restrictions in accordance with the properties for paste, size, and shape of an open area during a solder paste printing process by controlling ductility; and forms a bump having a uniform volume as a residue of paste can be reduced. Moreover, a bump volume can also be minutely adjusted. |
