| 摘要 |
PROBLEM TO BE SOLVED: To enhance noise resistance of a semiconductor device.SOLUTION: A wiring board 2 in a semiconductor device has a first wiring layer in which wiring 2d for transmitting signals is formed, and a second wiring layer provided contiguously to the upper layer or lower layer of the first wiring layer. In the second wiring layer, a conductor plane 2PL having an opening PLn formed at a position overlapping a part of the wiring 2d in the thickness direction, and a conductor pattern MP1 arranged in the opening PLh of the conductor plane 2PL are formed. The conductor pattern MP1 has a body (mesh pattern) MPm separated from the conductor plane 2PL, and a plurality of coupling parts MPj for coupling the body MPm and the conductor plane 2PL. |
