发明名称 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To process the upper surface peripheral edge while suppressing deformation of a substrate, and to suppress the energy required for the processing.SOLUTION: A substrate processing apparatus includes a substrate rotation unit for rotating a substrate while holding in horizontal position, a lower nozzle for discharging the fluid from below the substrate toward the lower surface thereof, an upper nozzle for discharging the process liquid from above the substrate toward the upper surface peripheral edge thereof. The lower nozzle includes a supply passage of heated fluid, at least one first discharge port for discharging a first portion of the heated fluid supplied from the supply passage, toward the lower surface inside surrounded by the upper surface peripheral edge, and a second discharge port for discharging a second portion of the heated fluid supplied from the supply passage, toward the lower surface peripheral edge. The sum of area of all second discharge ports is larger than that of all first discharge ports.</p>
申请公布号 JP2015142086(A) 申请公布日期 2015.08.03
申请号 JP20140015441 申请日期 2014.01.30
申请人 SCREEN HOLDINGS CO LTD 发明人 FUJIWARA TOMONORI;SHIBAYAMA NORIYUKI;YOSHIDA YUKIFUMI;SHIBATA TETSUYA
分类号 H01L21/304;H01L21/306 主分类号 H01L21/304
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