| 摘要 |
PROBLEM TO BE SOLVED: To reduce occurrence of malfunction of a thermoelectric module due to the impact of high temperature of ambient on a thermistor. ! SOLUTION: A thermoelectric module 10 includes a first support substrate 13 including an upper surface having a first region 13a and a second region 13b adjacent thereto, a second support substrate 14 provided so that the lower surface faces the first region 13a, a plurality of thermoelectric elements 15, 16 arranged between the first region 13a and second support substrate 14, and a rectangular parallelepiped positive temperature coefficient thermistor 11 mounted on the second region 13b and fixed by a metal bonding material 12. The bonding material 12 is adhering from the lower end to the upper end, at at least a part of at least one side face of the positive temperature coefficient thermistor 11. Consequently, occurrence of malfunction of the thermister 11 due to the impact of external high temperature is reduced, and the reliability is enhanced during t |
