| 摘要 |
PROBLEM TO BE SOLVED: To provide a suspension substrate that can prevent attenuation of electric signals transmitted over each layer of multilayered wiring. ! SOLUTION: A suspension substrate 1 comprises a metal supporting layer 10, a first insulating layer 20 disposed over the metal supporting layer 10, a first wiring layer 30 disposed over the first insulating layer 20 and having a pair of first wirings 31 and 32, a second insulating layer 40 disposed over the first insulating layer 20 and covering the first wirings 31 and 32, and a second wiring layer 50 disposed over the second insulating layer 40 and having a pair of second wirings 51 and 52. At least either of the pair of first wirings 31 and 32 and the pair of second wirings 51 and 52 has an interleaving structure, and the first wirings 31 and 32 and the second wirings 51 and 52 are, in a planar view, arranged alternately and not to overlap each other. ! COPYRIGHT: (C)2015,JPO&INPIT |
