半导体封装之制造方法，以及使用非接触式向上喷射系统以制造半导体封装;A METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE, AND THE USE OF A NON-CONTACT UPWARD JETTING SYSTEM IN THE FABRICATION OF A SEMICONDUCTOR PACKAGE

摘要

本发明有关一种半导体封装之制造方法，其包括以下步骤：(a)提供一半导体晶片，其底表面可以装附一或更多个焊接点；(b)藉由一非接触式向上喷射系统，以向上喷射涂布一可固化环氧树脂混合物至该半导体晶片之底部表面之至少一部份及/或至少一焊接点；(c)将此经覆盖之半导体晶片置于一电路板或一载体基板上；以及(d)将一或更多个焊接点耦接至该电路板或该载体基板，且将该可固化环氧树脂混合物固化。本发明更有关使用一种非接触式向上喷射系统以制造半导体封装。; (b) applying a curable epoxy composition upwards to at least one part of the bottom surface and/or to at least one of the solder contact points of the semiconductor chip by means of a non-contact jetting system; (c) placing the coated semiconductor chip onto a circuit board or a carrier substrate; (d) coupling the one or more solder contact points to the circuit board or the carrier substrate and curing the curable epoxy composition. The present invention further relates to the use of a non-contact upward jetting system in the fabrication of a semiconductor package.