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发明名称
COPPER PLATING BATH COMPOSITION
摘要
본 발명은 전자 응용들을 위한 인쇄 회로판, IC 기판, 반도성 및 유리 디바이스들의 제조에서의 구리 및 구리 합금 성막을 위한 수성 산성 도금 욕들에 관한 것이다. 본 발명에 따른 도금욕은 구리 이온들, 적어도 하나의 산, 및 양 말단에 아미노 잔기들을 포함하고 유기 결합 할로겐을 함유하지 않는 우레일렌 폴리머를 포함한다. 그 도금욕은, 홈 구조들을 구리로 충전하고 필러 범프 구조들의 빌드업에 특히 유용하다.
申请公布号
KR20150088307(A)
申请公布日期
2015.07.31
申请号
KR20157016894
申请日期
2013.11.12
申请人
ATOTECH DEUTSCHLAND GMBH
发明人
BRUNNER HEIKO;ROELFS BERND;WITCZAK AGNIESZKA;KOHLMANN LARS;MANN OLIVIER;OHDE CHRISTIAN;BANGERTER TIMO;FERRO ANGELO;KIRBS ANDREAS;SCHMOEKEL ANDRE;ROHDE DIRK;ACKERMANN STEFANIE
分类号
C25D3/38;C25D3/58;H01L21/288
主分类号
C25D3/38
代理机构
代理人
主权项
地址
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