| 摘要 |
<p>The present invention relates to a pre-bonding apparatus which is configured to thermal compress and pre-bond a panel having a flexible printed circuit (FPC) part divided into upper and lower parts and flexible printed circuits so as to perform a complete automation of the pre-bonding process and to effectively provide pre-bonding at the accurate position for each other by aligning the position of the flexible printed circuit and provide a pre-bonding apparatus for a flat display panel comprising: a panel loading unit configured to input the panel to which anisotropic conductive film (ACF) has been attached in a previous step and to load the same, and to allow the panel to be movable in an X-axis; a stage unit configured to support the panel loaded from the panel loading unit, adsorbing the panel on the upper portion thereof so as to support the same, and then to allow the panel to be supplied in a Y-axis; an align check unit on which the flexible printed circuits of the panel positioned on the stage unit are provided so as to be photographed, respectively, and which makes a signal for correcting the bonding positions of the flexible printed circuits by individual photographed image information; a clamp unit configured to be correspondingly positioned on the upper side of the stage unit and to allow the flexible printed circuit, positioned on the upper side of the panel before or after the correction operation, to be fixed; a bonding unit provided on one side of the clamp unit, capable of reciprocating up and down to the stage unit, thermally compressing the flexible printed circuit of the panel fixed by the clamp unit and bonding the same; and a panel unloading unit configured to pick up the panel pre-bonded in the bonding unit from the stage unit, to unload the same to the next step, and to allow the panel to be transferred in the X-direction.</p> |
