| 摘要 |
The present invention relates to a separation and transfer apparatus of a soldered assembly substrate, and, more specifically, to a separation and transfer apparatus of a soldered assembly substrate which can solder the assembly substrate, which is an assembly of a substrate jig and a substrate for suppressing an occurrence of warpage of the substrate during a solder reflow process, can easily separate the soldered substrate from the substrate jig with automated equipment, and can transfer the soldered substrate. |
