| 摘要 |
An apparatus includes a die and a build-up carrier, and the build-up carrier includes alternating layers of a conductive material and a dielectric material disposed on a device side of the die; a dielectric material embedding a portion of a thickness dimension of the die; and a plurality of carrier contact points disposed at a gradation between the device side of the die and the embedded thickness dimension of the die, and configured for connecting the carrier to a substrate. A method includes the steps of: disposing the die on a sacrificial substrate with the device side of the die on the opposite side of the sacrificial substrate; forming the build-up carrier adjacent to the device side of the die, wherein the build-up carrier includes the dielectric material defining the gradation between the device side of the die and a backside of the die, and the gradation includes the carrier contact points; and separating the die and the carrier from the sacrificial substrate. |
