METHOD FOR MANUFACTURING SELECTIVE ELECTRONIC PACKAGING MODULE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a selective electronic packaging module for improving a conventional process of manufacturing a selective electronic packaging module.SOLUTION: A method for manufacturing a selective electronic packaging module includes the steps of: disposing a plurality of electronic elements on a surface of a substrate; applying a liquid photosensitive resin material on the surface of the substrate by spraying; irradiating the liquid photosensitive resin material with ultraviolet light to form an embankment that encloses at least one electronic element; filling inside the embankment with an encapsulating material to cover at least one electronic element; and curing the encapsulating material to form a package that covers the at least one electronic element.