HEAT DISSIPATION MECHANISM FOR HANDHELD ELECTRONIC APPARATUS

摘要

A heat dissipation mechanism for handheld electronic apparatus includes a thin metal sheet having spaced integral clamping plates, and one or multiple heat pipes attached to the clamping plates and secured thereto. After insertion of each heat pipe into the clamping plates, the clamping plates are deformed to wrap about the loaded heat pipe(s).

主权项

1. A heat dissipation mechanism for a handheld electronic apparatus, comprising a thin metal sheet and at least one heat pipe mounted at said thin metal sheet, wherein:
said thin metal sheet comprises a plurality of integral clamping plates adapted for receiving said at least one heat pipe, each said clamping plate having at least one of two opposite lateral sides thereof deformed to wrap about one said heat pipe.