| 摘要 |
The present invention is directed to a method for forming polysilicon on a semiconductor substrate comprising providing amorphous silicon on a semiconductor substrate, exposing at least an area of the amorphous silicon to a first laser beam and a second laser beam, characterized in that during exposing the area to the second laser beam no displacement of the laser beam relative to the area occurs. In addition, the present invention is directed to the use of such method for producing large grain polysilicon. In particular, the present invention is directed to the use of such method for producing vertical grain polysilicon. Further, the present invention is directed to the use of such method for producing sensors, MEMS, NEMS, Non Volatile Memory, Volatile memory, NAND Flash, DRAM, Poly Si contacts and interconnects. |
