| 摘要 |
PROBLEM TO BE SOLVED: To provide a ball-shaped Au-Sn-Ag type solder alloy which is excellent in a wet-spreading property and joint property, is also excellent in processability, a stress relaxation property or the like, has a suitable melting point, has a low Au content, has a low cost and is lead-free for high temperature.SOLUTION: A ball-shaped Au-Sn-Ag type solder alloy has such a shape as to be an aspect ratio of 1.00 to 1.20, contains Sn of 27.5 mass% or more and less than 33.0 mass%, contains Ag of 8.0 to 14.5 mass% and the remainder comprising Au besides elements inevitably contained upon manufacture. |
