| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an industrial-scale device for holding and supporting wafers during processing, while maintaining the concentrical and rotational alignment of the wafers and preventing fracture, surface damage or warping of the wafers.SOLUTION: A system for mechanically holding a substrate during processing includes: a closeable wafer bonding chamber 210; and an upper block assembly 220 located inside the processing chamber and holding a wafer via three mechanical holding assemblies 110A-110C. The three mechanical holding assemblies protrude above a cover 225 of the wafer processing chamber, hold the wafer at a wafer edge and are adjusted from outside of the processing chamber. Two of the mechanical holding assemblies are lockable in a predetermined position relative to the wafer edge, and one of the mechanical holding assemblies maintains preload holding on the wafer edge via a preload mechanism.</p> |
