| 摘要 |
The present invention relates to an embedded printed circuit board, which comprises: an insulation substrate; a first element which is placed on one surface of the insulation substrate; and a second element which is placed on the other surface of the insulation substrate. Therefore, the embedded printed circuit board can be miniaturized with high density by placing the first and second elements with a half thickness of the conventional element at positions corresponding to each other on the insulation substrate, and can prevent warpage or bulging by symmetrically placing the first and second elements with the same thickness. |
