| 摘要 |
<p>[Problem] To provide a conductive paste for laser etching, which is suitable for laser etching that is capable of producing high-density electrode circuit wiring lines having an L/S of 50/50 μm or less at a low cost with a low environmental load, said high-density electrode circuit wiring lines having been considered difficult to be produced by a conventional screen printing method, and that is also capable of reducing thermal deterioration of a base. [Solution] A conductive paste for laser etching, which contains (A) a binder resin that is composed of a thermoplastic resin, (B) a metal powder and (C) an organic solvent, and which is characterized in that the binder resin (A) is a thermoplastic resin that has a number average molecular weight of 5,000-60,000 and a glass transition temperature of less than 60°C; a conductive thin film which is formed using the conductive paste; a conductive laminate; an electrical circuit; and a touch panel.</p> |
