发明名称 SOLDER DISCRIMINATION METHOD AND PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To accurately determine whether solder is lead-free solder or lead solder.SOLUTION: A solder discrimination method comprises steps of: forming a dummy land for discrimination (a land-forming step P1); applying paste-like solder to the land for discrimination (an application step P2); heating and melting the paste-like solder (a reflow step P4); and inspecting appearance of the solder which is solidified after being melted (an appearance inspection step P5). In the application step P2, the paste-like solder is applied to the land for discrimination so that a predetermined clearance is formed between first and second portions of the solder. In the appearance inspection step P5, it is inspected whether or not there is the clearance in the solder after reflow. When an inspection result shows that there is the clearance, such solder is determined as lead-free solder. When the inspection result shows that there is no clearance, such solder is determined as lead solder.
申请公布号 JP2015138890(A) 申请公布日期 2015.07.30
申请号 JP20140009873 申请日期 2014.01.22
申请人 DENSO CORP 发明人 IWATA KOJI
分类号 H05K3/34 主分类号 H05K3/34
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