| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and an electronic apparatus, which can improve reliability relevant to solder bonding without hindering a stress relaxation function by a lead terminal.SOLUTION: A semiconductor device comprises a lead frame 20 on a whole area of which a surface treatment for improving solder bondability is performed. Each lead frame 20 includes a first terminal part 21 on a semiconductor element 11 side and a second terminal part 22 on a land 4 side which are connected in a bent manner. The second terminal part 22 has a stepped part 22a which is formed to be thinner on the land 4 side in comparison with the first terminal part 21 side. |
