PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

A printed wiring board includes a resin insulation layer having a first surface and a second surface on an opposite side of the first surface, the resin insulation layer having an opening for a via conductor, a pad formed on the first surface of the resin insulation layer and provided to mount an electronic component, a conductive circuit formed on the second surface of the resin insulation layer, and a via conductor formed in the opening and connecting the pad and the conductive circuit. The pad has an embedded portion embedded in the resin insulation layer and a protruding portion protruding from the resin insulation layer, and the embedded portion has an external shape which is greater than an external shape the protruding portion.

主权项

1. A printed wiring board, comprising:
an outermost resin insulation layer having a first surface and a second surface on an opposite side with respect to the first surface; and a plurality of conducting structures formed in the outermost resin insulation layer such that the plurality of conducting structures is positioned in an electronic component mounting region of the outermost resin insulation layer, wherein each of the conducting structures is formed in an opening formed in the outermost resin insulation layer such that each of the conducting structures extends from the first surface to the second surface of the outermost resin insulation layer, each of the conducting structures comprises a pad on a first surface side of the outermost resin insulation layer, a conductive circuit formed on the second surface of the outermost resin insulation layer and a via conductor connecting the pad and the conductive circuit, the pad comprises an embedded portion embedded in the outermost resin insulation layer and a protruding portion protruding from the embedded portion beyond the first surface of the outermost resin insulation layer, and the embedded portion has an external shape which is greater than an external shape of the protruding portion such that the embedded portion has an upper surface recessed from the first surface of the outermost resin insulating layer.