发明名称 Structure to Dampen Barrel Resonance of Unused Portion of Printed Circuit Board Via
摘要 A printed circuit board includes a first trace, a second trace, and a first via. The first trace is in a first conductive layer. The second trace is in a second conductive layer. The first via interconnects the first trace and the second trace, and communicates a first signal from the first trace to the second trace through a third conductive layer. The third conductive layer has a higher impedance than the first conductive layer and the second conductive layer.
申请公布号 US2015216046(A1) 申请公布日期 2015.07.30
申请号 US201414163389 申请日期 2014.01.24
申请人 Dell Products, LP 发明人 Berke Stuart Allen;Farkas Sandor;Mutnury Bhyrav M.
分类号 H05K1/02;H05K3/46;H05K1/18;H05K1/11;H05K1/09 主分类号 H05K1/02
代理机构 代理人
主权项 1. A printed circuit board, comprising: a first trace in a first conductive layer; a second trace in a second conductive layer; and a first via to interconnect the first trace and the second trace, the first via to communicate a first signal from the first trace to the second trace through a third conductive layer, wherein the third conductive layer has a higher impedance than the first conductive layer and the second conductive layer.
地址 Round Rock TX US