发明名称 |
Structure to Dampen Barrel Resonance of Unused Portion of Printed Circuit Board Via |
摘要 |
A printed circuit board includes a first trace, a second trace, and a first via. The first trace is in a first conductive layer. The second trace is in a second conductive layer. The first via interconnects the first trace and the second trace, and communicates a first signal from the first trace to the second trace through a third conductive layer. The third conductive layer has a higher impedance than the first conductive layer and the second conductive layer. |
申请公布号 |
US2015216046(A1) |
申请公布日期 |
2015.07.30 |
申请号 |
US201414163389 |
申请日期 |
2014.01.24 |
申请人 |
Dell Products, LP |
发明人 |
Berke Stuart Allen;Farkas Sandor;Mutnury Bhyrav M. |
分类号 |
H05K1/02;H05K3/46;H05K1/18;H05K1/11;H05K1/09 |
主分类号 |
H05K1/02 |
代理机构 |
|
代理人 |
|
主权项 |
1. A printed circuit board, comprising:
a first trace in a first conductive layer; a second trace in a second conductive layer; and a first via to interconnect the first trace and the second trace, the first via to communicate a first signal from the first trace to the second trace through a third conductive layer, wherein the third conductive layer has a higher impedance than the first conductive layer and the second conductive layer. |
地址 |
Round Rock TX US |