| 主权项 |
1. A manufacturing method of a cover structure, the manufacturing method comprising:
disposing a metal substrate on a carrier having a surface, and the metal substrate comprising a plurality of openings that expose a portion of the surface of the carrier, wherein the metal substrate comprises a first metal layer formed thereon which is disposed conformally with the metal substrate, and the first metal layer covers the portion of the surface of the carrier exposed by the openings; laminating an insulating layer and a second metal layer located on the insulating layer on the metal substrate, wherein the insulating layer is located between the first metal layer and the second metal layer, and covers the first metal layer and fills the openings; and removing the metal substrate and the carrier to expose the first metal layer and define a plurality of cavity regions and a plurality of connecting regions connected with the cavity regions, wherein positions of the cavity regions correspond to positions of the metal substrate, and positions of the connecting regions correspond to the positions of the openings. |
