发明名称 METHOD OF FORMING A LAMINATE STRUCTURE HAVING A PLATED THROUGH-HOLE USING A REMOVABLE COVER LAYER
摘要 A core or sub-composite structure is provided including a dielectric layer between a first conductive film and a second conductive film. The first conductive film may include a first peelable/removable cover layer formed on or coupled to a first conductive layer. The second conductive film may include a second peelable/removable cover layer formed on or coupled to a second conductive layer.
申请公布号 WO2015004541(A3) 申请公布日期 2015.07.30
申请号 WO2014IB02315 申请日期 2014.06.23
申请人 SANMINA CORPORATION 发明人 IKETANI, SHINICHI;KERSTEN, DALE
分类号 H05K3/10;H05K3/46 主分类号 H05K3/10
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