ALUMINUM PLATING SOLUTION, ALUMINUM FILM, RESIN STRUCTURE, POROUS ALUMINUM OBJECT, AND POROUS ALUMINUM OBJECT MANUFACTURING METHOD

摘要

Provided is an aluminum plating solution with a large current density region in which aluminum plating is possible and small solution resistance. An aluminum plating solution comprises: an aluminum halide; one or more species selected from a group consisting of alkyl imidazolium halides, alkyl pyridinium halides and urea compounds; and an ammonium salt represented by general formula (1). The concentration of the ammonium salt is 1 g/L to 45 g/L. NR4 +∙X- ... general formula (1) In the general formula, R represents a hydrogen atom or an alkyl group of not more than 15 carbons that may have a side chain, and X represents a halogen atom. The Rs may be the same or different from each other.