发明名称 |
METHOD FOR PATTERNING A MICROSTRUCTURE |
摘要 |
The invention relates to a method for patterning one or more portions of a microstructure comprised of a flexible substrate, a conductor disposed on the substrate, and a metal layer disposed on the conductor, wherein the conductor is comprised of a stack of a first and a second transparent conductive oxide (TCO) layer, and a metal doped silicon oxide layer sandwiched between the two TCO layers. |
申请公布号 |
WO2015112419(A1) |
申请公布日期 |
2015.07.30 |
申请号 |
WO2015US11560 |
申请日期 |
2015.01.15 |
申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
SEBASTIAN, MUTHU;DOLEZAL, MICHAEL W |
分类号 |
G02F1/1343;C09K13/04;G06F3/044;H01L31/18 |
主分类号 |
G02F1/1343 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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