| 摘要 |
<p>The present invention relates to a chip-on glass bonding inspecting apparatus comprising: a base on which an inspection object is placed horizontally; a first imaging device which is mounted on the base, is positioned under the inspection object, irradiates the inspection object with visible light while moving in one direction (scan direction) with respect to the inspection object, continuously takes an image of a lower portion of the inspection object in a line scan manner by reflected light, and obtains a lower portion image for the whole inspection area of the inspection object; a second imaging device which is mounted on the base, is positioned above the inspection object, irradiates the inspection object with infrared light while moving in one direction (scan direction) with respect to the inspection object, continuously takes an image of an upper portion of the inspection object in a line scan manner by reflection light, and obtains an upper image for the whole inspection area of the inspection object; a drive means for moving the first imaging device and the second imaging device in the scan direction; and a control device which controls the drive means, and transmits a first line trigger signal and a second line trigger signal synchronized with a movement speed in the scan direction of the first imaging device and the second imaging device, to the first imaging device and the second imaging device. Accordingly, an alignment inspection and an indentation inspection which were separately performed by devices different from each other in the related art can be performed at once by one device, thereby saving an installation space and an installation cost of the device.</p> |
