| 摘要 |
PROBLEM TO BE SOLVED: To reduce crosstalk interference.SOLUTION: In the upper chip, a VSL, a VSL and a control line are stacked in order from the lower layer. That is, in a laminated type solid state imaging device 101, the control line 72 is arranged in the top layer of the upper chip 111. By doing such a way, influence on two VSLs from the lower chip 62 can be shielded by the control line. This disclosure, for example, can be applied to a CMOS solid state imaging device used for an electronic apparatus such as a camera device. |
