| 发明名称 |
Semiconductor Device Having Multiple Contact Clips |
| 摘要 |
A semiconductor device includes a device carrier, a first semiconductor chip mounted on the device carrier and a second semiconductor chip mounted on the device carrier. Further, the semiconductor device includes a first contact clip bonded to a first electrode of the first semiconductor chip, a second contact clip bonded to a first electrode of the second semiconductor chip and an insulating connector configured to hold the first contact clip and the second contact clip together. |
| 申请公布号 |
US2015214189(A1) |
申请公布日期 |
2015.07.30 |
| 申请号 |
US201414165720 |
申请日期 |
2014.01.28 |
| 申请人 |
Infineon Technologies Austria AG |
发明人 |
Tan Tian San;Long Theng Chao |
| 分类号 |
H01L25/065;H01R4/00;H01L23/31;H01L23/00;H01L25/00;H01L21/56 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device, comprising:
a device carrier; a first semiconductor chip mounted on the device carrier; a second semiconductor chip mounted on the device carrier; a first contact clip bonded to a first electrode of the first semiconductor chip; a second contact clip bonded to a first electrode of the second semiconductor chip; and an insulating connector configured to hold the first contact clip and the second contact clip together. |
| 地址 |
Villach AT |
