ENCAPSULATION STRUCTURE, ENCAPSULATION METHOD AND TEMPLATE USED IN ENCAPSULATION METHOD

摘要

Disclosed are an encapsulation structure, an encapsulation method and a template used in the encapsulation method. The encapsulation structure comprises: a substrate; a chip mounted on the substrate; lead wires for electrically connecting the substrate to the chip; and a protective layer which is formed on the substrate and is used for covering the chip, the lead wires and bonding pads connected to the lead wires, the size of the protective layer being smaller than that of the substrate. The encapsulation structure, the encapsulation method and the template used in the encapsulation method can solve the problems in the prior art of the great difficulty in designing a moulding cavity, a complicated moulding process, a high manufacturing cost and a large moulding material consumption.