| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a cutting device capable of more improving productivity than a conventional manner.SOLUTION: In a cutting device 1, when first cassette detection means 14 detects that a first cassette 17a is not placed on a first placement part 12 of a cassette placement stand 10, control means 41 regulates carrying-in/out means 20 from carrying a wafer W in/out of the first cassette 17a, and permits the carrying-in/out means 20 to carry the waver W in/out of a second cassette 17b, and when second cassette detection means 15 detects that the second cassette 17b is not placed on a second placement part 13 of the cassette placement stand 10, the control means 41 regulates the carrying-in/out means 20 from carrying the wafer W in/out of the second cassette 17b, and permits the carrying-in/out means 20 to carry the wafer W in/out of the first cassette 17a. For example, even when processing on the wafer W in the first cassette 17a is completed, it is possible to continue the processing on the wafer W in the second cassette 17b without stopping the cutting device 1.</p> |
